http://www.digitimes.com/NewsShow/MailHome.asp?datePublish=2010/5/10&pages=PD&seq=217

 

Backend supplier UTAC running at full capacity, says CEO

Ingrid Lee, Hsinchu; Jessie Shen, DIGITIMES [Thursday 13 May 2010]

United Test and Assembly Center (UTAC) has seen its plants in Singapore, Shanghai (China) and Thailand reach full capacity, according to company CEO Lee Joon Chung. Meanwhile, its subsidiary in Taiwan, which focuses on memory IC backend services, currently is running at a high utilization rate.

UTAC's Thailand plant is seeing growing demand for analog chips, with orders exceeding its capacity, said Lee. But the recent buyout of ASAT, including ASAT's operations in Dongguan, China, has immediately helped it satisfy customer demand.

The 60,000- to 70,000-square-meter Dongguan facility houses copper wire bonding process and quad-flat-pack-no lead (QFN) packaging lines, Lee said. The newly-acquired capacity will help expand UTAC's backend services for analog IC clients including Broadcom and Maxim, he added.

UTAC has also seen strong orders placed with its two plants in Singapore, thanks to demand from the communications chip and mixed-signal IC sectors, according to Lee. In addition, sales of its Shanghai plant are expected to jump 130% on year to US$70 million in 2010, driven by robust demand from China's IC design customers, said Lee.

UTAC plans to allocate more than US$200 million for 2010 capex, compared to US$70 million spent in 2009, Lee said. It will budget 55-60% of the amount for testing operations, and the remainder for the packaging segment, he added.

UTAC expects revenues to top US$240 million in the second quarter of 2010, up from US$210 million in the first quarter, according to Lee. For the full year, the company projects revenues will grow to US$1 billion from US$601 million in 2009. Lee said UTAC's sales ratio between mixed-signal IC, analog and memory products will be about 45:35:20 this year.

http://www.digitimes.com/NewsShow/MailHome.asp?datePublish=2010/5/13&pages=PD&seq=208

 

AMD said to use bulk 40nm at TSMC for Fusion chips

AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology, and related backend services to Siliconware Precision Industries (SPIL), according to industry sources.

Globalfoundries, AMD's spun-off fabrication arm, has also secured orders for the Fusion chips. A recentTechEye report quoted a senior VP of Globalfoundries as indicating that the foundry is in production for the AMD Fusion using 32nm SOI technology.

AMD at its most recent investors conference revealed that its Fusion laptop chips, which combine a CPU and GPU on the same piece of silicon, have been sampled, with OEM system availability in the first half of 2011.

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