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http://www.digitimes.com/NewsShow/MailHome.asp?datePublish=2010/6/15&pages=PD&seq=232

Chip packaging house Siliconware Precision Industries (SPIL) will raise 2010 capex budget by at least 30% from US$450 million to about US$585 million due to increased procurement of copper wire bonding equipment, according to the Taiwan-based company. The board of directors will determine the actual figure on a later date.

SPIL is expected to purchase more than 2,000 copper wire bonders from the second to fourth quarters of 2010, with 450 units going on line in the current quarter and 900 units each in the third and fourth quarters, the company said.

When asked whether the credit crisis in Europe has impacted SPIL, company chairman Bough Lin indicated that the overall IC market will continue to trend up in the next five years with emerging markets playing a bigger role in the world economy and strong demand coming from the communications and consumer electronics segments

SPIL approves NT$21 billion for 2010 capex
http://www.digitimes.com/NewsShow/MailHome.asp?datePublish=2010/6/25&pages=PM&seq=200

The board of directors of Siliconware Precision Industries (SPIL) has approved plans to budget NT$21 billion (US$652 million) in capex for 2010, according to a company filing with the Taiwan Stock Exchange (TSE). The chip packaging and testing house previously set a target of NT$14.3 billion.

SPIL was quoted in previous reports revealing plans to raise its 2010 capex budget by at least 30%, due to increased procurements of copper wire bonding equipment.